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| BUZ 51 SIPMOS (R) Power Transistor * N channel * Enhancement mode * Avalanche-rated Pin 1 G Pin 2 D Pin 3 S Type BUZ 51 VDS 1000 V ID 3.4 A RDS(on) 4 Package TO-220 AB Ordering Code C67078-S1344-A2 Maximum Ratings Parameter Continuous drain current Symbol Values 3.4 Unit A ID IDpuls 13.5 TC = 29 C Pulsed drain current TC = 25 C Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Avalanche energy, single pulse IAR EAR EAS 3.4 12 mJ ID = 3.4 A, VDD = 50 V, RGS = 25 L = 67 mH, Tj = 25 C Gate source voltage Power dissipation 410 VGS Ptot 20 125 V W TC = 25 C Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Semiconductor Group Tj Tstg RthJC RthJA -55 ... + 150 -55 ... + 150 1 75 E 55 / 150 / 56 C K/W 1 07/96 BUZ 51 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 1000 3 0.1 10 10 3.6 4 V VGS = 0 V, ID = 0.25 mA, Tj = 25 C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS 1 100 A VDS = 1000 V, VGS = 0 V, Tj = 25 C VDS = 1000 V, VGS = 0 V, Tj = 125 C Gate-source leakage current IGSS 100 nA 4 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS = 10 V, ID = 2.2 A Semiconductor Group 2 07/96 BUZ 51 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 1 3 980 85 45 - S pF 1300 130 70 ns 15 25 VDS 2 * ID * RDS(on)max, ID = 2.2 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 10 V, ID = 2.1 A RGS = 50 Rise time tr 70 105 VDD = 30 V, VGS = 10 V, ID = 2.1 A RGS = 50 Turn-off delay time td(off) 175 235 VDD = 30 V, VGS = 10 V, ID = 2.1 A RGS = 50 Fall time tf 70 95 VDD = 30 V, VGS = 10 V, ID = 2.1 A RGS = 50 Semiconductor Group 3 07/96 BUZ 51 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TC = 25 C Inverse diode direct current,pulsed A 0.95 0.3 2.5 3.4 13.5 V 1.4 s C Values typ. max. Unit ISM VSD trr Qrr TC = 25 C Inverse diode forward voltage VGS = 0 V, IF = 6.8 A Reverse recovery time VR = 100 V, IF=lS, diF/dt = 100 A/s Reverse recovery charge VR = 100 V, IF=lS, diF/dt = 100 A/s Semiconductor Group 4 07/96 BUZ 51 Power dissipation Ptot = (TC) Drain current ID = (TC) parameter: VGS 10 V 3.6 A 130 W 110 Ptot 100 90 80 70 60 50 ID 2.8 2.4 2.0 1.6 1.2 40 30 20 0.4 10 0 0 0.0 20 40 60 80 100 120 C 160 0 20 40 60 80 100 120 C 160 0.8 TC TC Safe operating area ID = (VDS) parameter: D = 0.01, TC = 25C 10 2 Transient thermal impedance Zth JC = (tp) parameter: D = tp / T 10 1 K/W A 10 0 t = 23.0s p ID 10 1 ZthJC 10 -1 100 s 10 -2 D = 0.50 1 ms DS =V 10 0 /I 0.20 10 10 ms -3 D 0.10 0.05 DS (on ) 10 -4 single pulse R 0.02 0.01 10 -1 0 10 10 1 10 2 DC 3 V 10 10 -5 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 s 10 0 VDS tp Semiconductor Group 5 07/96 BUZ 51 Typ. output characteristics ID = (VDS) parameter: tp = 80 s 7.5 A 6.5 l Typ. drain-source on-resistance RDS (on) = (ID) parameter: VGS 13 Ptot = 125W kj h i g f VGS [V] a 4.0 b 4.5 c 5.0 a b c d 11 ID 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 10 20 30 40 50 e RDS (on) 10 9 8 7 6 5 4 3 2 VGS [V] = a 4.0 4.5 b 5.0 c 5.5 d 6.0 e f 6.5 7.0 g 7.5 h i j k 8.0 9.0 10.0 20.0 d 5.5 d e 6.0 f 6.5 g 7.0 h 7.5 e f g i k h j c i j 8.0 9.0 k 10.0 l 20.0 b a 1 V 75 0 0.0 60 1.0 2.0 3.0 4.0 5.0 A 6.5 VDS ID Typ. transfer characteristics ID = f (VGS) Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s VDS2 x ID x RDS(on)max 4.0 A parameter: tp = 80 s, VDS2 x ID x RDS(on)max 4.0 S ID 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0.0 0 1 2 3 4 5 6 7 8 V 10 gfs 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0.0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 VGS A ID 3.2 Semiconductor Group 6 07/96 BUZ 51 Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 2.2 A, VGS = 10 V 20 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 1 mA 4.6 V 4.0 RDS (on) 16 14 12 10 8 6 4 2 0 -60 98% VGS(th) 3.6 3.2 2.8 2.4 2.0 typ 2% 98% typ 1.6 1.2 0.8 0.4 0.0 -60 -20 20 60 100 C 160 -20 20 60 100 C 160 Tj Tj Typ. capacitances C = f (VDS) parameter:VGS = 0V, f = 1MHz 10 1 Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s 10 2 nF C 10 0 A IF Ciss 10 1 10 -1 10 0 Coss Crss Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%) 10 -2 0 5 10 15 20 25 30 V VDS 40 10 -1 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 07/96 BUZ 51 Avalanche energy EAS = (Tj ) parameter: ID = 3.4 A, VDD = 50 V RGS = 25 , L = 67 mH 450 mJ Typ. gate charge VGS = (QGate) parameter: ID puls = 5 A 16 V EAS 350 300 VGS 12 0,2 VDS max 0,8 VDS max 10 250 8 200 6 150 100 50 0 20 4 2 0 40 60 80 100 120 C 160 0 20 40 60 80 100 120 140 160 nC 190 Tj Q Gate Drain-source breakdown voltage V(BR)DSS = (Tj ) 1200 V 1160 V(BR)DSS 1140 1120 1100 1080 1060 1040 1020 1000 980 960 940 920 900 -60 -20 20 60 100 C 160 Tj Semiconductor Group 8 07/96 BUZ 51 Package Outlines TO-220 AB Dimension in mm Semiconductor Group 9 07/96 |
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